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Low ball BGA: a new concept in thermoplastic packaging
Home
Publications
Low ball BGA: a new concept in thermoplastic packaging
Low ball BGA: a new concept in thermoplastic packaging
KG
K. Gilleo
K. Gilleo
JB
J. Belmonte
J. Belmonte
GP
G. Pham-Van-Diep
G. Pham-Van-Diep
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4 October 2004
proceedings article
Published by
Institute of Electrical and Electronics Engineers (IEEE)
https://doi.org/10.1109/iemt.2004.1321688
Abstract
No abstract available
Keywords
NEAR INFRARED
ELECTRONICS PACKAGING
OPTOELECTRONICS
SPHERICAL GEOMETRY
BALL GRID ARRAY
PLASTICS
THERMAL STABILITY
CHIP
SATISFIABILITY
LEAD
OPTOELECTRONIC DEVICES
SPACE TECHNOLOGY
NICKEL
MICROELECTROMECHANICAL SYSTEMS
COPPER
Cited by 4 articles