Holey and Unholey Semiconductors
- 5 February 1999
- journal article
- perspective
- Published by American Association for the Advancement of Science (AAAS) in Science
- Vol. 283 (5403), 804-805
- https://doi.org/10.1126/science.283.5403.804
Abstract
Thermoelectric materials, which have applications in refrigeration and power generation, are experiencing a surge in research activity. Many different materials are investigated with the goal of maximizing electrical conductivity while minimizing thermal conductivity, which is required for good thermoelectric performance. Only recently was a 30-year deadlock in thermoelectric performance overcome. Predictions for the new materials suggest that important further improvements are on the horizon, with promising applications in the computer and other high-tech industries.This publication has 6 references indexed in Scilit:
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