Thermal Expansion at Low Temperatures
- 1 September 1960
- journal article
- Published by Springer Nature in Nature
- Vol. 187 (4741), 927-929
- https://doi.org/10.1038/187927b0
Abstract
No abstract availableThis publication has 6 references indexed in Scilit:
- The Precise Measuremient of Small CapacitancesIRE Transactions on Instrumentation, 1958
- Low-Temperature Thermal Expansion of CopperPhysical Review B, 1957
- LXXXII. On the thermal expansion of solids at low temperaturesJournal of Computers in Education, 1955
- Coefficients of Thermal Expansion of Solids at Low Temperatures. I. The Thermal Expansion of Copper from 15 to 300°K.Journal of the American Chemical Society, 1954
- A new method for measuring the thermal expansion of solids at low temperatures; the thermal expansion of copper and aluminium and the Grüneisen rulePhysica, 1954
- Thermal Expansion at Low TemperaturesPhysical Review B, 1951