Process and Accelerated Aging Test of GANG Bonding for Gold‐PlatedTAB Outer Leads

Open Access
Publisher Website
Google Scholar
Abstract
This paper presents the evaluation results of thermocompression GANG Bonding of gold-plated TAB outer leads to three kinds of metallized ceramic substrates. Gold-Selective Plating (GSP) substrates for multi-chip package, Thick Film (TF) substrates for multi-chip package and Single Chip Packages (SCP) which have a trimetal combination of refractory metal (tungsten), Nickel and Gold.