Some observations on copper electrodeposits
- 31 May 1961
- journal article
- Published by Elsevier in Electrochimica Acta
- Vol. 4 (1), 72-77
- https://doi.org/10.1016/0013-4686(61)80007-8
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- The structure of electrodeposited copper—III: The effect of current density and temperature on growth habitElectrochimica Acta, 1960
- The structure of electrodeposited copper—I: An experimental study of the growth of copper during electrodepositionElectrochimica Acta, 1960
- The Growth Habit of Electrodeposited CopperTransactions of the IMF, 1960
- Observations on the Development of Electroplating Deposit Structures on Single Crystals of CopperProceedings of the Physical Society, 1959
- Dislocation Etch Pits and Polygonization in High-Purity CopperJournal of Applied Physics, 1959
- Twinned epitaxy of copper on copperJournal of Research of the National Bureau of Standards, 1958