Structure Evolution During Processing of Polycrystalline Films
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- 1 August 2000
- journal article
- Published by Annual Reviews in Annual Review of Materials Science
- Vol. 30 (1), 159-190
- https://doi.org/10.1146/annurev.matsci.30.1.159
Abstract
▪ Abstract Polycrystalline films have wide variety of applications in which their grain structures affect their performance and reliability. Thin film growth techniques and growth conditions affect grain shapes, the distribution of grain sizes, and the distribution of the crystallographic orientations of grains. Variations in these structural properties are affected by the conditions under which grain nucleation, growth, coarsening, coalescence, and thickening occur. General trends in structural evolution in polycystalline films, as a function of processing conditions and materials class, are discussed in terms of these fundamental kinetic processes.Keywords
This publication has 92 references indexed in Scilit:
- Texture development mechanisms in ion beam assisted depositionJournal of Applied Physics, 1998
- Evolution of grain structure in thin film reactionsJournal of Electronic Materials, 1997
- Computer simulation of strain energy effects vs surface and interface energy effects on grain growth in thin filmsActa Materialia, 1996
- In Situ Measurement of Stresses in Thin FilmsMRS Proceedings, 1991
- Macroscopic model for columnar growth of amorphous films by sputter depositionJournal of Vacuum Science & Technology A, 1991
- Measurements of the intrinsic stress in thin metal filmsVacuum, 1990
- Overview no. 65Acta Metallurgica, 1988
- Correlations for diffusion constantsActa Metallurgica, 1980
- Interface morphology development during stress corrosion cracking: Part I. Via surface diffusionMetallurgical Transactions, 1972
- Grain size distribution in thin films—1. Conservative systemsJournal of Physics and Chemistry of Solids, 1967