High Speed Grinding of Silicon Nitride With Electroplated Diamond Wheels, Part 1: Wear and Wheel Life

Abstract

An investigation is reported on high speed grinding of silicon nitride using electroplated single-layer diamond wheels. This article is concerned with wheel wear and wheel life, and a second paper (ASME J. Manuf. Sci. Eng., 122, pp. 42–50) deals with wheel topography and grinding mechanisms. It has been suggested that grinding performance may be enhanced at higher wheel speeds due to a reduction in the undeformed chip thickness. Grinding experiments were conducted at wheel speeds of 85 and 149 m/s with the same removal rate. Contrary to expectations, the faster wheel speed gave no improvements in surface finish, grinding ratio, or wheel life. Microscopic observations of the wheel surface revealed dulling of the abrasive grains by attritious wear, thereby causing a progressive increase in the forces and energy until the end of the useful life of the wheel. For all grinding conditions, a single-valued relationship was found between the wheel wear and the accumulated sliding length between the abrasive grains and the workpiece. A longer wheel life and improved grinding performance can be obtained when the operating parameters are selected so as to reduce the abrasive sliding length per unit volume of material removal. [S1087-1357(00)00301-4]