Microfabrication of high-temperature silicon devices using wafer bonding and deep reactive ion etching
- 1 June 1999
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Journal of Microelectromechanical Systems
- Vol. 8 (2), 152-160
- https://doi.org/10.1109/84.767111
Abstract
No abstract availableThis publication has 15 references indexed in Scilit:
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