Low Pressure Sputtering System of the Magnetron Type

Abstract
A new design of a low pressure sputtering system of magnetron type is described. The optimum sputtering conditions are discussed in relation to the system. It is shown that this system is able to produce uniform thin films with good reproducibility, and especially to produce a metal oxide film by reactive sputtering. Some typical configurations are presented for use in the laboratory and on a production scale.

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