Ultra-Dense: an MCM-based 3-D digital signal processor

Publisher Website

1 January 1992

journal article
Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Vol. 15 (4), 438-443
https://doi.org/10.1109/33.159871

Abstract

No abstract available

Keywords

This publication has 3 references indexed in Scilit:

Internal thermal resistance of a multi-chip packaging design for VLSI based systems
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
A high performance reconfigurable parallel processing architecture
Published by Association for Computing Machinery (ACM) ,1989
The DSP32C: AT&Ts second generation floating point digital signal processor
IEEE Micro, 1988

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