High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm
- 1 September 2000
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components and Packaging Technologies
- Vol. 23 (3), 542-545
- https://doi.org/10.1109/6144.868855
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Embedded microstrip interconnection lines for gigahertz digital circuitsIEEE Transactions on Advanced Packaging, 2000
- Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applicationsIEEE Transactions on Components and Packaging Technologies, 1999
- Extraction of equivalent circuits for microstrip components and discontinuities using the genetic algorithmIEEE Microwave and Guided Wave Letters, 1998
- Conductive adhesives for high-frequency applicationsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1998