Encapsulation of Integrated Circuits Containing Beam Leaded Devices with a Silicone RTV Dispersion
- 1 September 1976
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 12 (3), 182-187
- https://doi.org/10.1109/tphp.1976.1135126
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Interconnection systems for solid-state components in hybrid integrated circuitsProceedings of the IEEE, 1971
- Encapsulation of integrated circuitsProceedings of the IEEE, 1969
- Beam-Lead TechnologyBell System Technical Journal, 1966