Chemical Vapor Deposition of Copper from Hexafluoroacetylacetonato Copper(I) Vinyltrimethylsilane: Deposition Rates, Mechanism, Selectivity, Morphology, and Resistivity as a Function of Temperature and Pressure
- 1 May 1993
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 140 (5), 1434-1439
- https://doi.org/10.1149/1.2221574