Residual Stress, Mechanical Behavior and Electrical Properties of Cu/Nb Thin-Film Multilayers
- 1 January 1995
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 15 references indexed in Scilit:
- The mechanical and tribological behavior of Cu-Nb in situ compositesWear, 1993
- Oxidation behavior of CuNb microcompositesMaterials Science and Engineering: A, 1992
- Effect of thermal aging on CuNb microcompositesMaterials Science and Engineering: A, 1992
- Stress and plastic flow in silicon during amorphization by ion bombardmentJournal of Applied Physics, 1991
- Intrinsic stress in sputtered thin filmsJournal of Vacuum Science & Technology A, 1991
- Mechanical properties of thin filmsMetallurgical Transactions A, 1989
- The resistivity and microstructure of heavily drawn Cu-Nb alloysJournal of Applied Physics, 1989
- High-field critical current in i n s i t u multifilamentary Cu-Sn-Nb alloysApplied Physics Letters, 1977
- Superconducting and mechanical properties of i n s i t u formed multifilamentary Cu-Nb3Sn compositesJournal of Applied Physics, 1977
- The tension of metallic films deposited by electrolysisProceedings of the Royal Society of London. Series A, Containing Papers of a Mathematical and Physical Character, 1909