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Conduction Cooling for an LSI Package: A One-Dimensional Approach
Home
Publications
Conduction Cooling for an LSI Package: A One-Dimensional Approach
Conduction Cooling for an LSI Package: A One-Dimensional Approach
RC
R. C. Chu
R. C. Chu
UH
U. P. Hwang
U. P. Hwang
RS
R. E. Simons
R. E. Simons
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1 January 1982
journal article
Published by
IBM
in
IBM Journal of Research and Development
Vol. 26
(1)
,
45-54
https://doi.org/10.1147/rd.261.0045
Abstract
No abstract available
Cited by 73 articles