Non-destructive S-parameter measurement of a hermetically encapsulated package with comparison to high-frequency simulation
- 26 June 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
A novel methodology is presented for non-destructive S-parameter measurement of hermetically encapsulated packages using an on-chip programmable termination network and a port reduction method. Measured results for a QFN package are compared to simulations.Keywords
This publication has 5 references indexed in Scilit:
- Port reduction methods for scattering matrix measurement of an n-port networkIEEE Transactions on Microwave Theory and Techniques, 2000
- Electromagnetic simulation of bonding wires and comparison with wide band measurementsIEEE Transactions on Advanced Packaging, 2000
- A novel approach to 3-D modeling of packaged RF power transistorsIEEE Transactions on Microwave Theory and Techniques, 1999
- An experimental technique for full package inductance matrix characterizationIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1996
- Package inductance characterization at high frequenciesIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1994