Reliability considerations in the design of one-megabit bubble memory chips
- 1 September 1980
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Magnetics
- Vol. 16 (5), 1106-1110
- https://doi.org/10.1109/tmag.1980.1060875
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Electrical characterization of a packaged 100 kBit major/minor loop bubble deviceIEEE Transactions on Magnetics, 1976
- Magnetic bubble dual-in-line package (DIP) functional and reliability testingIEEE Transactions on Magnetics, 1976
- Long-Term Propagation Studies in Magnetic-Bubble DevicesPublished by AIP Publishing ,1974