Fast annealing of 4 in. arsenic-implanted silicon wafers using an imaging furnace

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Abstract
An imaging furnace equipped with a 6.5 kW Xe arc lamp has been used to anneal 4 in. arsenic-implanted silicon wafers in a single exposure. Electrical and structural investigations have shown complete activation without appreciable diffusion of the impurities, and the regrown layers are defect free for low implant dose (5×1014/cm2, 100 keV); for high implant dose (1015/cm2, 200 keV), however, dislocation loops are observed.