High-resolution electron microscopy of a SiC/SiC joint brazed by a Ag-Cu-Ti alloy
- 1 September 1988
- journal article
- research article
- Published by Springer Nature in Journal of Materials Science
- Vol. 23 (9), 3362-3366
- https://doi.org/10.1007/bf00551319
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Brazing of pressureless-sintered SiC using Ag-Cu-Ti alloyJournal of Materials Science, 1987
- Bonding mechanism between silicon carbide and thin foils of reactive metalsJournal of Materials Science, 1985
- Interfacial reactions between SiC and aluminium during joiningJournal of Materials Science, 1984
- Bonding mechanism between alumina and niobiumJournal of Materials Science, 1981