Copper deposition and thermal stability issues in copper-based metallization for ULSI technology
- 31 December 1992
- journal article
- Published by Elsevier in Materials Science Reports
- Vol. 9 (1), 1-51
- https://doi.org/10.1016/0920-2307(92)90011-o
Abstract
No abstract availableThis publication has 83 references indexed in Scilit:
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