Mass diffusion in polycrystalline copper/electroplated gold planar couples
- 1 July 1972
- journal article
- Published by Springer Nature in Metallurgical Transactions
- Vol. 3 (7), 1989-1997
- https://doi.org/10.1007/bf02642589
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Diffusion of Cu in AuCu alloyScripta Metallurgica, 1970
- Self-diffusion and interdiffusion in gold-nickel alloysActa Metallurgica, 1957
- Diffusion of Gold into CopperJournal of Applied Physics, 1954
- Lattice and Grain Boundary Self-Diffusion in SilverJournal of Applied Physics, 1951
- Die Diffusionsgeschwindigkeit von Kupfer in GoldZeitschrift für Physikalische Chemie, 1932