Silver nanosintering: a lead-free alternative to soldering
- 1 November 2008
- journal article
- research article
- Published by Springer Science and Business Media LLC in Applied Physics A
- Vol. 93 (2), 467-470
- https://doi.org/10.1007/s00339-008-4807-5
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
- Nanoimprinting of conductive tracks using metal nanopowdersApplied Physics Letters, 2007
- Low-Temperature Sintering with Nano-Silver Paste in Die-Attached InterconnectionJournal of Electronic Materials, 2007
- Impact of the ROHS Directive on high-performance electronic systemsJournal of Materials Science: Materials in Electronics, 2006
- Reliability of high temperature solder alternativesMicroelectronics Reliability, 2006
- Metal–metal bonding process using Ag metallo-organic nanoparticlesActa Materialia, 2005
- Thermal behavior of silver nanoparticles for low-temperature interconnect applicationsJournal of Electronic Materials, 2005
- Increase in thermal stability induced by organic coatings on nanoparticlesPhysical Review B, 2004
- Three Distinctive Melting Mechanisms in Isolated NanoparticlesThe Journal of Physical Chemistry B, 2001
- Size-Dependent Melting Properties of Small Tin Particles: Nanocalorimetric MeasurementsPhysical Review Letters, 1996
- Densification during Sintering in the Presence of a Liquid Phase. I. TheoryJournal of Applied Physics, 1959