Copper Interconnection with Tungsten Cladding for UlSI
- 1 January 1991
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Projecting interconnect electromigration lifetime for arbitrary current waveformsIEEE Transactions on Electron Devices, 1990
- Interconnection and electromigration scaling theoryIEEE Transactions on Electron Devices, 1987