New high power planar gate GaAs MESFETs with improved gate-drain breakdown voltage
- 19 January 1995
- journal article
- Published by Institution of Engineering and Technology (IET) in Electronics Letters
- Vol. 31 (2), 137-139
- https://doi.org/10.1049/el:19950070
Abstract
The Letter presents a new approach to power GaAs MESFETs with planar gate structures, based on the MBE growth technique on an undoped surface GaAs layer on an ion-implanted channel layer. This undoped GaAs layer increases the gate-drain breakdown voltage and serves as both an ideal passivation layer and an ideal annealing cap of ion implanted channels. To realise a good surface condition before MBE growth, the UV-ozone surface treatment is introduced. This new simple structure offers high performance power GaAs MESFETs.Keywords
This publication has 3 references indexed in Scilit:
- A 3.5V, 1.3W GaAs power multichip IC for cellular phonePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Application of heterojunction FET to power amplifier for cellular telephoneElectronics Letters, 1994
- WSiN/SiO2 capped annealing for Si-implanted GaAsJournal of Applied Physics, 1990