A 30-ps Si bipolar IC using super self-aligned process technology

Abstract

A new 30-ps Si bipolar IC technology has been developed by scaling down a bipolar transistor's lateral geometry and forming shallow junctions. The n-p-n transistor has a 0.35-µm-wide emitter and a 1.57-µm-wide base region fabricated using super self-aligned process technology (SST) with 1-µm rule optical lithography. The fTvalues achieved for this device are 13.7 GHz at a collector-emitter voltage of 1 V and 17.1 GHz at 3 V. Propagation delay times (fan-in = fan-out = 1) of 30 ps/gate at 1.48 mW/gate for nonthreshold logic and 50 ps/ gate at 1.46 mW/gate for low-level current mode logic have been achieved.