Mechanical Stress Reliability Factors for Packaging GaAs MMIC and LSIC Components
- 1 December 1987
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 10 (4), 612-617
- https://doi.org/10.1109/tchmt.1987.1134784
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Temperature and Orientation Dependence of Plastic Deformation in GaAs Single Crystals Doped with Si, Cr, or ZnJournal of the American Ceramic Society, 1975
- Measurement of Tensile Strength of CeramicsJournal of the American Ceramic Society, 1968
- A Statistical Distribution Function of Wide ApplicabilityJournal of Applied Mechanics, 1951
- VI. The phenomena of rupture and flow in solidsPhilosophical Transactions of the Royal Society A, 1921