The physical properties of bisphenol‐a‐based epoxy resins during and after curing. II. Creep behavior above and below the glass transition temperature
- 30 January 1989
- journal article
- Published by Wiley in Journal of Polymer Science Part B: Polymer Physics
- Vol. 27 (2), 307-324
- https://doi.org/10.1002/polb.1989.090270207
Abstract
No abstract availableKeywords
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