A technique for detecting critical loads in the scratch test for thin film adhesion

Abstract

A new technique has been developed for detecting critical loads when using the scratch test to determine the adhesion of deposited thin films. In this technique, a 2μ diam 15 keV electron beam impinges upon the sample and the intensity of the induced x‐radiation emission from the film and the substrate are monitored simultaneously and used to determine the applied normal load necessary to cause a diamond probe to cleanly strip off the film. Preliminary results are discussed using this technique to study the adhesion of rf sputtered TiC films on high speed steel substrates. Preheating of the substrate prior to deposition was shown to significantly increase the film adhesion.