Use of BCB in high frequency MCM interconnects
- 1 January 1996
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 19 (1), 42-47
- https://doi.org/10.1109/96.486483
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- Mcm-D Technology for a Communication ApplicationPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- A photosensitive-BCB on laminate technology (MCM-LD)Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Cu/photosensitive-BCB thin-film multilayer technology for high-performance multichip modulesIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1995
- Measurement of the Electrical Properties of High Performance Dielectric Materials for Multichip ModulesMicroelectronics International, 1994
- Processing and microwave characterization of multilevel interconnects using benzocyclobutene dielectricIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1993
- Benzocyclobutene (BCB) dielectrics for the fabrication of high density, thin film multichip modulesJournal of Electronic Materials, 1990
- Dielectric Loss in Integrated Microwave CircuitsBell System Technical Journal, 1969