Study on mobility of water and polymer chain in epoxy and its influence on adhesion
- 23 April 2002
- journal article
- Published by Wiley in Journal of Applied Polymer Science
- Vol. 85 (1), 1-8
- https://doi.org/10.1002/app.10473
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
- Contributions of the nanovoid structure to the kinetics of moisture transport in epoxy resinsJournal of Polymer Science Part B: Polymer Physics, 2000
- A discussion of the molecular mechanisms of moisture transport in epoxy resinsJournal of Polymer Science Part B: Polymer Physics, 2000
- Moisture diffusion in epoxy systemsJournal of Applied Polymer Science, 1999
- Contributions of the nanovoid structure to the moisture absorption properties of epoxy resinsJournal of Polymer Science Part B: Polymer Physics, 1998
- Multidimensional 2H NMR studies of the non-exponential chain relaxation of polystyrene above the glass transitionJournal of Non-Crystalline Solids, 1994
- Preencapsulation cleaning methods and control for microelectronics packagingIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1994
- Water in epoxy resins Part II. Diffusion mechanismPolymer Engineering & Science, 1985
- Thermal expansion and swelling of cured epoxy resin used in graphite/epoxy composite materialsJournal of Materials Science, 1980
- Quadrupolar echo deuteron magnetic resonance spectroscopy in ordered hydrocarbon chainsChemical Physics Letters, 1976