Biodegradable Polyanhydrides as Encapsulation Layers for Transient Electronics
- 9 June 2020
- journal article
- research article
- Published by Wiley in Advanced Functional Materials
- Vol. 30 (31)
- https://doi.org/10.1002/adfm.202000941
Abstract
No abstract availableKeywords
Funding Information
- Materials Research Science and Engineering Center, Harvard University (NSF DMR‐1720139)
- Korea University (K2008831)
- National Research Foundation of Korea (NRF‐2019R1C1C1004232)
- National Science Foundation, United Arab Emirates (2018M3A9D3079285)
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