Evidence for Interaction Effects in the Low-Temperature Resistance Rise in Ultrathin Metallic Wires

Abstract

New measurements are reported of the low-temperature resistance rise in ultrathin wires of Cu, Ni, and AuPd, which confirm the proportionality to $T^{-\frac{1}{2}}$ predicted by the interaction model. Moreover, these results and those in the literature show an absolute magnitude consistent within a factor of ∼ 2 with the predictions of this model, using independently determined parameters of similar accuracy. It is inferred that interaction effects are at least as important as localization effects in these systems.