Dielectric properties of silicon nitride films deposited by microwave electron cyclotron resonance plasma chemical vapor deposition at low temperature

Abstract
The dielectric properties of amorphous silicon nitride (SiNx) films that were prepared by microwave electron cyclotron resonance plasma chemical vapor deposition at low temperature in the frequency range 5 Hz–1 MHz have been investigated. The dielectric dispersion in the frequency range exhibits two fractional power laws of (ε′−ε∞′)∝ω−p1 and (ε′−ε∞′)∝ωn1−1 with p1=0.12–0.18 and n1=0.95–0.96. These are close to the result predicted by the many-cluster anomalous conduction theory of fractal structure.