Metallization of Cu on polytetrafluoroethylene modified by keV Ar+ ion irradiation
- 1 May 1998
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
- Vol. 16 (3), 1110-1114
- https://doi.org/10.1116/1.590018
Abstract
No abstract availableThis publication has 13 references indexed in Scilit:
- Surface modification of polytetrafluoroethylene by Ar+ irradiation for improved adhesion to other materialsJournal of Applied Polymer Science, 1997
- Texture development in polycrystalline thin filmsMaterials Science and Engineering B, 1995
- A new method to obtain Cu films with lower resistivity and higher interface adhesion on different substratesJournal of Vacuum Science & Technology A, 1995
- On the Texture of Electroless Copper Films on Epitaxial Cu Seed Layers Grown on Si (100) and Si (111) SubstratesJournal of the Electrochemical Society, 1992
- Metal polyimide interface: A titanium reaction mechanismJournal of Vacuum Science & Technology A, 1986
- An XPS study of Pd sputtered onto polyester filmJournal of Electron Spectroscopy and Related Phenomena, 1982
- Four-point sheet resistance correction factors for thin rectangular samplesSolid-State Electronics, 1977
- Surface treatment of polymers for adhesive bondingJournal of Applied Polymer Science, 1967
- The Decompostion of Polytetrafluoroethylene in a Glow DischargeThe Journal of Physical Chemistry, 1967
- Treatment of teflon to promote bondabilityJournal of Applied Polymer Science, 1962