Re-examination of the relationship between packing coefficient and thermal expansion coefficient for aromatic polyimides
- 31 December 1987
- journal article
- Published by Elsevier BV in Polymer
- Vol. 28 (13), 2282-2288
- https://doi.org/10.1016/0032-3861(87)90388-0
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
- High‐strength–high‐modulus polyimide fibers II. Spinning and properties of fibersJournal of Applied Polymer Science, 1986
- In‐plane orientation of polyimideJournal of Polymer Science: Polymer Physics Edition, 1983
- Spectroscopic Studies of Poly[N,N'-bis(phenoxyphenyl)pyromellitimide]. 2. Structural Changes of Polyimide upon YieldingMacromolecules, 1980
- PolyimidesJournal of Polymer Science: Macromolecular Reviews, 1976
- Thermogravimetric study of the effect of the chemical structure of polyimides on their thermal stabilityJournal of Thermal Analysis and Calorimetry, 1975
- The relaxation mechanical properties of aromatic polyimides of varying structurePolymer Science U.S.S.R., 1974
- A Novel Planar Multilevel Interconnection Technology Utilizing PolyimideIEEE Transactions on Parts, Hybrids, and Packaging, 1973
- Thermomechanical and thermogravimetric analyses of systematic series of polyimidesJournal of Applied Polymer Science, 1972
- A study of the synthesis, structure and properties of polyimides (polyarimides)Polymer Science U.S.S.R., 1971
- PolyimidesJournal of Polymer Science Part C: Polymer Symposia, 1967