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Reliability Study of Plastic Encapsulated Copper Lead Frame/Epoxy Die Attach Packaging System
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Publications
Reliability Study of Plastic Encapsulated Copper Lead Frame/Epoxy Die Attach Packaging System
Reliability Study of Plastic Encapsulated Copper Lead Frame/Epoxy Die Attach Packaging System
JH
J. R. Howell
J. R. Howell
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1 April 1981
proceedings article
Published by
Institute of Electrical and Electronics Engineers (IEEE)
in
8th Reliability Physics Symposium
https://doi.org/10.1109/irps.1981.362981
Abstract
No abstract available
Keywords
THERMAL RESISTANCE
LEAD
THERMAL CONDUCTIVITY
Cited by 6 articles