CuS thin films on flexible substrates
- 1 January 2004
- journal article
- Published by Institution of Engineering and Technology (IET) in Electronics Letters
- Vol. 40 (4), 273-274
- https://doi.org/10.1049/el:20040192
Abstract
A report is presented on the electrical and structural properties of Cu7S4 films deposited on polyimide substrate at temperatures close to room temperature using the water solutions of complex-salt compounds. The X-ray diffraction data identified Cu7S4 crystalline monoclinic structure. The resistance of the film increased by 350% under tensile strain and by 5% under compressive strain. Maximal value of the gauge factor was found to be G≃103.Keywords
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