Time‐temperature cure behavior of epoxy based structural adhesives
- 25 August 1979
- journal article
- Published by Wiley in Polymer Engineering & Science
- Vol. 19 (10), 687-691
- https://doi.org/10.1002/pen.760191007
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- A semimicro thermomechanical technique for characterizing polymeric materials: Torsional braid analysisAIChE Journal, 1974
- Isothermal transitions of a thermosetting systemJournal of Polymer Science: Polymer Symposia, 1974
- Novel technique for following the rigidity changes accompanying the curing of polymersJournal of Applied Polymer Science, 1962