Fluorinated, Low Thermal Expansion Coefficient Polyimides For Interlayer Dielectric Application: Thermal Stability, Refractive Index And High Temperature Modulus Measurements
- 1 January 1995
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Relaxation Behavior of Polyimides Based on 2,2'-Disubstituted BenzidinesMacromolecules, 1995
- Structure Development in Polyimide FilmsMRS Proceedings, 1993