Superconducting integrated circuit fabrication with low temperature ECR-based PECVD SiO/sub 2/ dielectric films
Open Access
- 1 June 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Applied Superconductivity
- Vol. 5 (2), 2303-2309
- https://doi.org/10.1109/77.403046
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
- Intrinsic stress in DC sputtered niobiumIEEE Transactions on Applied Superconductivity, 1993
- Josephson junction integrated circuit process with planarized PECVD SiO/sub 2/ dielectricIEEE Transactions on Applied Superconductivity, 1993
- Sub-μm linewidth input coils for low T c integrated thin-film dc superconducting quantum interference devicesApplied Physics Letters, 1992
- A Low Noise DC-SQUID Based on Nb/Al-AlOx/Nb Josephson JunctionsPublished by Springer Nature ,1992
- A simple and robust niobium Josephson junction integrated circuit processIEEE Transactions on Magnetics, 1991
- Electron cyclotron resonance microwave discharges for etching and thin-film depositionJournal of Vacuum Science & Technology A, 1989
- Mechanism of Dry Etching of Silicon Dioxide: A Case of Direct Reactive Ion EtchingJournal of the Electrochemical Society, 1985
- Bridge and van der Pauw Sheet Resistors for Characterizing the Line Width of Conducting LayersJournal of the Electrochemical Society, 1978
- Control of Palladium Adherence to Silicon Dioxide for Photolithographic EtchingJournal of the Electrochemical Society, 1976
- Resistivity Measurements on Germanium for TransistorsProceedings of the IRE, 1954