Effects of interfacial mixing on the properties of RF sputtered NiFe films

Abstract
Auger Electron Spectroscopy in conjunction with ion sputtering technique has been used to measure the composition profile in Au/NiFe and NiFe/SiO2 films. Interfacial mixing was found to exist as a result of biased sputtering and its extent was affected by bias voltage and substrate materials. Changing the bias voltage from 0 to 60 volts in sputtering NiFe films of 600 Å thickness on SiO2 can reduce the resistivity by 40% and Hc by about 80% but increase the magneto‐resistive effect from 1% to 2.5%. Also as a result of mixing at the Au/NiFe interface, the magnetic moment has been observed to be diluted by about 80% in a 500 Å NiFe film deposited on a glass substrate at 0 to 60 volts. The degree of dilution was significantly reduced if deposition was made on a SiO2 substrate or at higher voltages. An intermediate layer of 100 Å SiO2 was found to be effective in eliminating the mixing between Au and NiFe.