Temperature effects of pad conditioning process on oxide CMP: Polishing pad, slurry characteristics, and surface reactions
- 1 February 2006
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 83 (2), 362-370
- https://doi.org/10.1016/j.mee.2005.10.004
Abstract
No abstract availableThis publication has 20 references indexed in Scilit:
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