Copper/polyimide Materials System for High Performance Packaging
- 1 December 1984
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 7 (4), 384-393
- https://doi.org/10.1109/tchmt.1984.1136378
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Measurement of stresses generated in cured polyimide filmsJournal of Vacuum Science & Technology A, 1983
- Electrical Design of a High Speed Computer PackageIBM Journal of Research and Development, 1982
- High-Density Board Fabrication TechniquesIBM Journal of Research and Development, 1982
- The Thin-Film Module as a High-Performance Semiconductor PackageIBM Journal of Research and Development, 1982
- Polyimide insulators for multilevel interconnectionsThin Solid Films, 1981
- Properties of Thin Polyimide FilmsJournal of the Electrochemical Society, 1980