Platinum Metal Plating—A Process and Applicational Survey

Abstract

Processes for the electrodeposition of the platinum group metals are reviewed, from the viewpoint of general electrolyte and deposit characteristics rather than that of detailed plating procedures. Applications are briefly discussed, with special reference to the electronics field. On grounds of limited availability, the platinum metals can offer no serious challenge to the pre-eminence of gold but they offer advantages in respect of wear resistance, elevated temperature stability, and erosion resistance.