Stressing Rate Effects on the Bend and Compressive Strengths of a Piezoelectric Ceramic
- 1 March 1977
- journal article
- Published by Wiley in Journal of the American Ceramic Society
- Vol. 60 (3-4), 168-170
- https://doi.org/10.1111/j.1151-2916.1977.tb15498.x
Abstract
No abstract availableThis publication has 13 references indexed in Scilit:
- Mixed‐Mode Fracture from Controlled Surface Flaws in Hot‐Pressed Si3N4Journal of the American Ceramic Society, 1976
- Effect of Internal Stress on the Strength of BaTiO3Journal of the American Ceramic Society, 1976
- Criteria for Growth of the Angled CrackPublished by ASTM International ,1976
- Strain-energy-density factor applied to mixed mode crack problemsInternational Journal of Fracture, 1974
- Slow crack growth in brittle materials under dynamic loading conditionsInternational Journal of Fracture, 1974
- A Simple Method for Studying Slow Crack GrowthJournal of Testing and Evaluation, 1973
- Some basic problems in fracture mechanics and new conceptsEngineering Fracture Mechanics, 1973
- Dynamic and Static Fatigue of Silicate GlassesJournal of the American Ceramic Society, 1971
- Determination of Tablet Strength by the Diametral-Compression TestJournal of Pharmaceutical Sciences, 1970
- On brittle fracture pathsInternational Journal of Fracture, 1965