Surface Mount Solder Joint Long‐term Reliability: Design, Testing, Prediction
- 1 January 1989
- journal article
- Published by Emerald Publishing in Soldering & Surface Mount Technology
- Vol. 1 (1), 14-22
- https://doi.org/10.1108/eb037660
Abstract
In this paper an overview of the issues underlying surface mount solder joint long‐term reliability is presented. The paper gives state‐of‐the‐art solutions for ‘Design for Reliability’ in simple design tool form, discusses the important accelerated reliability test issues, and provides the equations to estimate the reliability of SM product in use as well as the expected cyclic life in accelerated tests.Keywords
This publication has 5 references indexed in Scilit:
- Cavitation in a Pb/low-Sn solder during low cycle fatigueScripta Metallurgica, 1988
- Creep and Stress Relaxation in Solder Joints of Surface-Mounted Chip CarriersIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- Functional Cycles and Surface Mounting Attachment ReliabilityCircuit World, 1985
- Forces, Moments, and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed BoardsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- Thermal Stress and Low Cycle FatigueJournal of Applied Mechanics, 1966