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Computer Aided Stress Modeling for Optimizing Plastic Package Reliability
Home
Publications
Computer Aided Stress Modeling for Optimizing Plastic Package Reliability
Computer Aided Stress Modeling for Optimizing Plastic Package Reliability
SG
Steven Groothuis
Steven Groothuis
WS
Walter Schroen
Walter Schroen
MM
Masood Murtuza
Masood Murtuza
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1 March 1985
proceedings article
Published by
Institute of Electrical and Electronics Engineers (IEEE)
in
8th Reliability Physics Symposium
https://doi.org/10.1109/irps.1985.362096
Abstract
No abstract available
Keywords
FINITE ELEMENT METHODS
ENCAPSULATION
DISPLAYS
CHIP
TEMPERATURE
INNOVATION PROCESS
FINITE ELEMENT
FORM FACTOR
PREDICTIVE MODELS
VERY LARGE SCALE INTEGRATION
SILICON
STRAIN GAUGE
STRESS ANALYSIS
Cited by 49 articles