Relaxations of thermosets. IV. A dielectric study of crosslinking of diglycidyl ether of bisphenol‐a by two curing agents
- 1 August 1990
- journal article
- research article
- Published by Wiley in Journal of Polymer Science Part B: Polymer Physics
- Vol. 28 (9), 1621-1639
- https://doi.org/10.1002/polb.1990.090280916
Abstract
No abstract availableKeywords
This publication has 25 references indexed in Scilit:
- Relaxations of thermosets. III. Sub‐Tg dielectric relaxations of bisphenol‐A–based epoxide cured with different cross‐linking agentsJournal of Polymer Science Part B: Polymer Physics, 1990
- Highly crosslinked polymersProgress in Polymer Science, 1989
- Architecture of gelatin gelsContemporary Physics, 1988
- Dynamic mechanical properties of structural glass fibre-epoxy compositesPolymer, 1987
- Mechanical and dielectric relaxations of epoxide resins containing the spiro‐ring structure. II. Effect of the introduction of methoxy branches on low‐temperature relaxations of epoxide resinsJournal of Polymer Science Part B: Polymer Physics, 1987
- The physical properties of bisphenol‐A‐based epoxy resins during and after curingJournal of Polymer Science Part B: Polymer Physics, 1986
- Torsional Braid AnalysisPublished by American Chemical Society (ACS) ,1983
- Effects of moisture and stoichiometry on the dynamic mechanical properties of a high‐performance structural epoxyJournal of Applied Polymer Science, 1979
- The beta relaxation in epoxy resin‐based networksJournal of Applied Polymer Science, 1979
- Dielectric Relaxation of Rigid Molecules in Supercooled DecalinThe Journal of Chemical Physics, 1972