High frequency circuit components on micromachined variable thickness substrates
- 1 January 1997
- journal article
- Published by Institution of Engineering and Technology (IET) in Electronics Letters
- Vol. 33 (4), 303-304
- https://doi.org/10.1049/el:19970221
Abstract
The use of Si micromachining techniques to enhance high frequency planar circuit design flexibility by offering a method for varying the substrate thickness in selective locations on the wafer is presented.Keywords
This publication has 2 references indexed in Scilit:
- Development of self-packaged high frequency circuits using micromachining techniquesIEEE Transactions on Microwave Theory and Techniques, 1995
- Anisotropic etching of siliconIEEE Transactions on Electron Devices, 1978