Hollow cathode sputtering, wherein substrates are mounted on the axis of an elongated tubular source, provides an attractive method for coating objects of complex shape. For a uniform current density and cosine emission, the sputtered flux at all points within the cathode where end effects are unimportant is equal to the cathode erosion flux.This paper describes experiments in which thick (∠5 mil) OFHC copper coatings were deposited at reasonably high rates (∠4000 Å/min) onto substrates incorporating deep channels as well as convex and concave corners. Argon working gas pressures were varied from 1 to 150 mTorr; average substrate bias current density from zero to 1.25 mA/cm2. Coating thickness distributions and microstructures were examined by preparing metallographic cross sections. Substrate heating and plasma measurements are also reported. Low pressure operation yielded best microstructures and most complete surface coverage. The method compares favorably with ion plating for many applications.